Novel Concepts announced its new IsoSkin heat spreader material, a technology that the company says could eventually render the fans that cool notebooks and PCs obsolete.

IsoSkin spreaders could eventually be used to replace the outer “skin” of portable electronics, thereby eliminating the need for heat sinks and fans, according to Novel Concepts. The material dissipates heat 20 times more effectively than copper, the company said.

IsoSkin heat spreaders could also being used to complement or improve overall heat sink performance by reducing the likelihood of circuits in microprocessors and semiconductors overheating or melting.